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To understand the production process of LED lamp bead packaging, just master these 11 steps
author:tom2020 Release time:2020-04-15 13:55:50 Read:13
Thefirstistochoose,choosetherightsize,luminosity,color,voltage,currentLEDlampbeadpackagechip,thefollowingisapointdescription:1.Crystalexpansion.TheexpansionmachineisusedtoexpandtheentireLEDwaferfilmpr

The first is to choose, choose the right size, luminosity, color, voltage, current LED lamp bead package chip, the following is a point description:


1. Crystal expansion. The expansion machine is used to expand the entire LED wafer film provided by the manufacturer uniformly, so that the LED crystals that are closely arranged on the surface of the film are pulled apart, which is convenient for crystal piercing.


2. Adhesive, place the crystal expansion ring of the expanded crystal on the surface of the adhesive machine where the silver paste layer has been scraped, and put the silver paste on the back. Point silver paste. Suitable for bulk LED chips. Use glue dispenser to deposit appropriate amount of silver paste on PCB printed circuit board.


3. Solid crystal, put the expanded crystal ring prepared with silver paste into the thorn crystal frame, and the operator will puncture the LED wafer with the thorn crystal pen on the PCB printed circuit board under the microscope.


4. Ding Jing, put the PCB printed circuit board with thorns into the heat circulation oven and keep it at a constant temperature for a period of time, and take it out after the silver paste is cured (not for a long time, otherwise the LED chip coating will bake yellow, that is, oxidized Must cause difficulties). If there is LED chip bonding, the above steps are required; if only IC chip bonding is needed, the above steps are cancelled.


5. Wire bonding, use aluminum wire bonding machine to bridge the wafer and the corresponding pad aluminum wire on the PCB board, that is, the inner lead of the COB is welded.


6. For initial testing, use special testing tools (different equipment for different uses of COB, the simplest is high-precision regulated power supply) to test the COB board, and return the unqualified board to repair.


7. Dispensing, use the dispensing machine to place the right amount of AB glue on the bonded LED die, and the IC is encapsulated with black glue, and then packaged according to customer requirements.


8, curing, put the sealed PCB printed circuit board or lamp holder in a thermal cycle oven and set it at a constant temperature, and set different drying time according to the requirements.


9, General test, the packaged PCB printed circuit board or lamp holder with special testing tools for electrical performance testing, distinguish good and bad.


10. Spectroscopy, use the spectrometer to distinguish the brightness of different brightness lamps according to the requirements, and package them separately.


11. Enter the warehouse, and then go out in batches to create a comfortable and energy-saving life for everyone.


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